Optical Metrology & Inspection for Fan-out Wafer Level Packaging (FOWLP)
Ben Garland will give a talk on June 9, 2016 at NCCAVS Thin Film User Group (TFUG) and CMP User Group (CMPUG).
*FREE, No Registration Needed, Just Show Up!
Date: June 9, 2016
Venue: Semi Global Headquarters, Seminar Rooms 1 & 2 3081. Zanker Rd. San Jose, CA
Time: 2:40 - 3:10 PM
Fan-Out Wafer Level Packaging (FOWLP) technology provides a cost effective solution for semiconductor devices requiring a smaller package footprint with higher input / output (I/O) along with improved thermal and electrical performance. Compared to conventional wafer level packaging, FOWLP presents tough challenges to traditional optical metrology and inspection tools due to a higher degree of wafer warpage, small RDL critical dimensions, and low reflectivity of epoxy mold compound (EMC). In this presentation, we will describe a unique optical metrology and inspection solution developed by Zeta Instruments and demonstrate its effectiveness on challenging FOWLP applications such as 2um RDL profiling, polyimide thickness measurement over black EMC, and defect inspection on carrier glass substrate and on EMC. The multi-mode approach to metrology allows the measurement of film thickness, step height, CD and roughness in the same tool. This reduces the yield loss from handling and contamination when using multiple tools. A multi-mode tool also reduces the overall metrology cost of the backend fab. In the past few years, the world's leading Foundry and OSATs have adopted the Zeta solution for their most advanced FOWLP process lines.Learn More
About Ben Garland
Ben Garland has over 19 years of technical sales & management experience. Prior to joining Zeta Instruments in 2009, he was a Sales Engineer and Area Technical Manager for Thermo Fisher Scientific, formerly Nicolet where he was a successful solutions provider responsible for the sales of the Nicolet branded spectroscopy systems. These products included both micro & macro FTIR, Raman & NIR spectrometer systems serving customers in the semiconductor, electronics, biotech, university, government, solar, aerospace, & pharmaceutical industries. He was also a member of Thermo's elite "taste-makers" group to help test, develop, and market new spectroscopy products. He has a MS degree in chemistry from the University of Utah and a BS degree in chemistry with a minor in physics from Idaho State University.
Zeta Instruments designs, manufactures, sells and services Multi-Mode optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage. Zeta has delivered consistent growth and has installed over 200 systems in 20 countries. Its locations include headquarters in San Jose, CA, a regional office in Shanghai, China, and sales and service representatives worldwide.